In the first, the ISFET chip is encapsulated on all sides by epoxy resin except for the chemically sensitive gate region of the ISFET which has to be in direct contact with the medium being measured. (Quelle: bmb+f Forschungslandkarte Deutschland 1998)
：
够形
耐磨损，
附着
低
缩
特征
叉连
聚合
种，尤
涂
合剂
合
。
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